Method and apparatus for coupling a semiconductor die to die terminals

ABSTRACT

A method and apparatus for coupling a semiconductor die to terminals of a die package in which the die is housed. The apparatus comprises a die having first and second terminals. A first conductive member is elongated between a first end portion and a second end portion thereof such that the second end portion is proximate to the first terminal. A second conductive member is elongated between a first end portion and second end portion thereof such that the second end portion of the second conductive member is proximate to the second terminal of the die and the second conductive member is generally parallel to the first conductive member. The second end portions of the first and second conductive members may be coupled with conductive couplers to the first and second die terminals, respectively. The conductive members and conductive couplers may be sized and shaped to produce a selected capacitance and/or a selected impedance at the die terminals. The first and second conductive members may each have an intermediate portion between the first and second end portions thereof that is narrower than the second end portions thereof, and the conductive members may be staggered by axially offsetting the second end portion of the second conductive member from the second end portion of the first conductive member.

TECHNICAL FIELD

[0001] The present invention is directed toward a method and apparatusfor coupling a semiconductor die to die terminals.

BACKGROUND OF THE INVENTION

[0002] Semiconductor dies are typically encased in a plastic shell orpackage prior to installation in microelectronic devices. The plasticpackage makes the die easier to handle during installation and protectsthe die from dust, dirt and other contaminants after it has beeninstalled. The package includes package terminals, such as pins or othersimilar devices which have one end coupled to the bond pads of the dieand an opposite end accessible outside the package. The ends of thepackage terminals accessible outside the package may be coupled to othermicroelectronic components, linking the die to those components.

[0003]FIG. 1 is a top isometric view of a representative conventionaldie package 10. FIG. 2 is a partially broken top plan view of theconventional die package 10 shown in FIG. 1. Referring to FIGS. 1 and 2,the die package 10 comprises a plastic body 12 housing a die 20 therein.For purposes of clarity, the top portion of the body 12 is shown inphantom lines in FIG. 1 and partially broken away in FIG. 2. The die 20includes bond pads 21 that are coupled to circuitry within the die. Thebond pads 21 are also coupled with wire bonds 50 to leadfingers 40 thatextend outwardly away from the die to the edges of the die package 10where they are coupled to pins 30. The pins 30 project outwardly beyondthe edges of the body 12 and may be coupled with other electroniccomponents in a conventional manner so that the die 20 may communicatewith the other components

[0004] One problem with the conventional die package 10 described aboveis that the leadfingers 40 may limit the minimum size of the die packageand die 20. The ends of the leadfingers 40 must have a surface areawhich is large enough to permit the bond wires 50 to be easily coupledthereto. The leadfingers 40 must also be large enough to secure the die20 in a selected position as the die is encapsulated in the body 12during manufacture of the die package 10. The large surface area of theleadfingers 40 and the spacing between adjacent leadfingers may limitthe minimum size of the die package 10. The size and spacing of theleadfingers 40 may also limit the minimum distance between thecorresponding bond pads 21 to which the leadfingers are connected andmay accordingly limit the minimum size of the die 20.

[0005] Another problem with the conventional die package 10 describedabove is that the leadfingers 40 may increase the capacitance measuredat the pins 30, thereby reducing the speed with which signals maypropagate between the pins 30 and the corresponding bond pads 21. Thereduced signal speed may decrease the overall speed and efficiency ofthe die 20 and the microelectronic components with which the die iscoupled.

[0006] Yet another problem with the conventional die package 10 shown inFIGS. 1 and 2 is that an impedance measured at one of the pins 30 may bedifferent than an impedance measured at another pin 30. The impedancemismatch between pins 30 of the same die 20 probably adversely affectsthe relative timing of signals coupled to the die through different pins30.

[0007] In another conventional arrangement (not shown), the die 20 maybe coupled to leadfingers 40 which are positioned directly on thesurface of a printed circuit board. The printed circuit board may thenbe coupled to other microelectronic devices or other printed circuitboards. This alternate arrangement may suffer from the same problemsdiscussed above, including a limited minimum die size, reduced signalspeed and mismatched impedances.

SUMMARY OF THE INVENTION

[0008] The present invention is directed toward a method and apparatusfor coupling a semiconductor die to terminals of a die package orprinted circuit board which supports the die. An apparatus in accordancewith one embodiment of the invention includes a microelectronic devicecomprising a semiconductor die having at least one terminal. Themicroelectronic device further comprises a conductive member elongatedbetween a first end portion and a second end portion. The second endportion is proximate to the terminal of the die. The conductive memberhas an intermediate portion between the first and second end portionsthat is narrower than the second end portion. In one embodiment, thesecond end portion is positioned adjacent the semiconductor die, and inanother embodiment, the second end portion is positioned on a surface ofthe semiconductor die. In either embodiment, the second end portion maybe coupled to the die terminal with a conductive coupler.

[0009] In another embodiment of the invention, the microelectronicdevice comprises a package having first and second package terminals anda semiconductor die positioned within the package and having first andsecond die terminals. A first conductive member is coupled at one end tothe first package terminal. A first conductive coupler is coupledbetween the first die terminal and the first conductive member. Themicroelectronic device further comprises a second conductive membercoupled at one end to the second package terminal. A second conductivecoupler is coupled between the second die terminal and the secondconductive member. The first conductive member and first conductivecoupler are selected to produce a first impedance at the first packageterminal and the second conductive member and second conductive couplerare selected to produce a second impedance at the second packageterminal. The first and second impedances are selected to beapproximately equal.

[0010] In still another embodiment, the semiconductor die may bepositioned on the surface of a printed circuit board or other substrate.The substrate may include conductive members that are offset relative toeach other and the semiconductor die. The conductive members may becoupled to the die terminals with conductive couplers and may also beconnected to vias in the substrate.

[0011] The present invention is also embodied in a method forpositioning conductive members proximate to first and second adjacentterminals of a semiconductor die. In one embodiment, the methodcomprises positioning an end of a first conductive member proximate thefirst terminal of the die and positioning an end of a second conductivemember proximate the second terminal of the die. The ends of the firstand second conductive members are staggered such that the end of thesecond conductive member is spaced apart from the second terminal by adistance which is greater than the distance between the end of the firstconductive member and the first terminal.

[0012] The present invention is also embodied in a method for selectingthe impedance of a conductive path between a terminal of a semiconductordie and a terminal of a package in which the die is housed. In oneembodiment, the method comprises selecting a size and material of aconductive member to have a first impedance and selecting a size andmaterial of a conductive coupler to have a second impedance. Theconductive member has first and second opposite ends and the methodfurther comprises connecting the first end of the conductive member tothe terminal of the package and connecting the conductive coupler toextend between the terminal of the die and the second end of theconductive member.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013]FIG. 1 is a top isometric view of a die package in accordance withthe prior art.

[0014]FIG. 2 is a partially broken top plan view of the die packageshown in FIG. 1.

[0015]FIG. 3 is a partially broken top plan view of a die package havingstaggered conductive members extending over a surface of a semiconductordie in accordance with one embodiment of the invention.

[0016]FIG. 4 is a partially broken top plan view of a die package havingstaggered conductive members and the same number of package terminals asshown in FIG. 1, housing a die with an increased number of dieterminals, in accordance with another embodiment of the invention.

[0017]FIG. 5 is a partially broken top plan view of a die package havingstaggered conductive members and the same number of package terminals asshown in FIG. 1, housing a die with closely spaced die terminals inaccordance with another embodiment of the invention.

[0018]FIG. 6 is a top plan view of a lead frame for supporting theconductive members shown in FIG. 4.

[0019]FIG. 7 is a partially broken top plan view of a die package havingstaggered conductive members positioned proximate a semiconductor die inaccordance with another embodiment of the invention.

[0020]FIG. 8 is a partially broken top plan view of a die package havingconductive members and conductive couplers of varying lengths inaccordance with yet another embodiment of the invention.

[0021]FIG. 9 is an isometric view of the top surface of a portion of asubstrate having staggered conductive members thereon and a bottomisometric view of a die having correspondingly positioned solder balls.

[0022]FIG. 10 is an isometric view of the top surface of a portion of asubstrate having enlarged staggered conductive members thereon and abottom isometric view of a die having correspondingly positional solderballs.

[0023]FIG. 11 is a top isometric view of a die mounted to a substratehaving staggered conductive members in accordance with anotherembodiment of the invention.

[0024]FIG. 12 is a schematic of a computer having a die package inaccordance with still another embodiment of the invention.

DETAILED DESCRIPTION OF THE INVENTION

[0025] The present invention is embodied in an apparatus and method forcoupling terminals of a die to terminals of a die package or printedcircuit board which supports the die. An aspect of the invention is thatconductive members which extend between the die terminals and thepackage terminals may be staggered to increase the number of conductivemembers and die terminals that may be positioned in a given die package.A further aspect of the invention is that the conductive members may beconnected to the die terminals with conductive couplers, and the sizeand composition of the conductive members and conductive couplers may beselected to produce a selected impedance at the package terminals. FIGS.3-10 illustrate various embodiments of the apparatus and methods, andlike reference numbers refer to like parts throughout the figures.

[0026]FIG. 3 is a top plan view of a representative die package 110 inaccordance with an embodiment of the invention. The die package 110generally comprises a solid plastic body 112 which is shown partiallybroken away and which encapsulates a semiconductor chip or die 120. Thedie 120 has die terminals or bond pads 121 which are coupled withconductive couplers 150 and conductive members 140 to package terminals130 positioned along the edges 113 of the body 112. The packageterminals 130 project away from the body 112 so that they may be easilycoupled to other microelectronic components.

[0027] The body 112 may comprise a plastic or other suitable insulatingmaterial. As shown in FIG. 3, the die 120 may be centered within thebody 112 and may include die terminals 121 which are aligned along acentral axis of an upper surface 122 of the die. In other embodiments,the die terminals 121 may have other configurations, as will bediscussed in greater detail below with reference to FIG. 7. In oneembodiment, the die terminals 121 may comprise conventional bond pads,as shown in FIG. 3, and may comprise solder balls, as will be discussedin greater detail below with reference to FIGS. 9 and 10, or otherterminal devices in other embodiments.

[0028] The conductive members or leads 140 extend over the upper surface122 of the die 120 in a “lead-over-chip” configuration so as to beproximate to the die terminals 121. The upper surface 122 of the die 120accordingly comprises an insulating layer to electrically isolate theconductive members 140 from each other. The conductive members 140 maybe adhesively bonded to the die 120 to hold the die 120 in positionduring manufacturing, as will be discussed in greater detail below withreference to FIG. 5.

[0029] Each conductive member 140 is elongated and has a bonding portion142 at one end, a terminal portion 143 at an opposite end, and anintermediate portion 144 extending between the bonding portion and theterminal portion. Each bonding portion 142 is connected with aconductive coupler 150 to the corresponding die terminal 121. Theconductive couplers 150 may comprise gold wire, aluminum wire, aconductive adhesive, or other suitable conductive materials which have alow resistance and may be easily bonded to the bonding portion 142 witha mechanical or chemical/mechanical bond. Each bonding portion 142 has awidth sufficient to keep the bonding portion stable when the conductivecoupler 150 is connected thereto. Accordingly, the bonding portion 142may have a width of approximately 0.008 inch in one embodiment and mayhave other widths in other embodiments.

[0030] The intermediate portion 144 of each conductive member 140 has awidth which is less than the width of the bonding portion 142 and lessthan the width of the conventional leadfingers 40 shown in FIGS. 1 and2. Accordingly, the spacing between adjacent conductive members 140 maybe reduced by positioning the bonding portion 142 of one conductivemember adjacent the intermediate portion 144 of the neighboringconductive member. Each conductive member 140 may be axially offsetrelative to its neighbor, producing a staggered pattern of conductivemembers, as shown in FIG. 3.

[0031] In one embodiment, the intermediate portions 144 have a width ofapproximately 0.004 inch. The intermediate portions 144 may have otherwidths in other embodiments, so long as the intermediate portions arenarrow enough to allow adjacent conductive members 140 to be staggered,as shown in FIG. 3, and wide enough to support the die 120 in positionwhen the body 112 is formed around the die. Furthermore, if theintermediate portions 144 are too narrow, the conductive members 140 maytend to curl or otherwise bend away from the die 120, making itdifficult to attach the conductive members to the die, and making itdifficult to attach the conductive couplers 150 to the conductivemembers. Accordingly, the intermediate portions 144 may be wide enoughin one embodiment to keep the conductive member 140 substantially flatagainst the upper surface 122 of the die 120.

[0032] The terminal portion 143 of each conductive member 140 isconnected to a corresponding package terminal 130, as shown in FIG. 3.The package terminals 130 may comprise pins in one embodiment and maycomprise other types of terminals or connectors in other embodiments. Inone embodiment, the bonding portion 142, intermediate portion 144, andterminal portion 143 are formed integrally with each other and with thecorresponding package terminal 130, as will be discussed in greaterdetail below with reference to FIG. 5.

[0033] One advantage of the conductive members 140 shown in FIG. 3 isthat they may be spaced more closely together than conventionalleadfingers. Accordingly, an increased number of conductive members 140may be positioned on the upper surface 122 of the die 120, as may beseen by comparing the die package 110 shown in FIG. 3 with theconventional die package 10 shown in FIG. 2. The die package 110 shownin FIG. 3 has sixteen conductive members 140, while the conventional diepackage 10 shown in FIG. 2 has only fourteen leadfingers 40 positionedon a die 20 having the same dimensions as the die shown in FIG. 3. Thedie package 110 may have a greater or lesser number of conductivemembers 140 in alternate embodiments. The increased number of conductivemembers 140 may provide the connections necessary to transmit signals toand/or from an increased number of die terminals 121.

[0034] A further advantage of the conductive members 140 is that therelatively narrow intermediate portions 144 thereof reduce the overallsize, and therefore capacitance, of each conductive member when comparedwith a conventional leadfinger. The conductive members 140 mayaccordingly transmit signals to and/or from the die terminal 121 at afaster rate than the conventional leadfingers 40 shown in FIGS. 1 and 2.

[0035] In the embodiment shown in FIG. 3, the die package 110 has anincreased number of die terminals 121, conductive members 140, andpackage terminals 130 when compared to the conventional die package 10shown in FIG. 2. In another embodiment shown in FIG. 4, the die package110 a may have the same number and spacing of package terminals 130 asthe conventional die package 10, so as to be compatible with devicesconfigured to be coupled to the conventional die package. The diepackage 110 a may have an increased number of conductive members 140 anddie terminals 121, as discussed above with reference to FIG. 3, so longas the additional conductive members 140 are coupled to existing packageterminals 130. Accordingly, two pairs of conductive members 140 a and140 b are each connected to existing package terminals 130 a. The diepackage 110 a accordingly has twelve package terminals, as does theconventional die package 10 shown in FIG. 2. The die package 110 a hassixteen conductive members 140 and die terminals 121, as compared withthe conventional die package 10 shown in FIGS. 1 and 2 which has onlyfourteen leadfingers 40 and bond pads 21.

[0036] An advantage of the die package 110 a shown in FIG. 4 is that itmay include a die 120 having an increased number of die terminals 121while the die package itself has the same number of package terminals130 as a conventional package. The increased number of die terminals 121may increase the performance of the die, as discussed above withreference to FIG. 3. Furthermore, because the die package 110 a has thesame number of package terminals 130 as a conventional die package, itmay be easily coupled to the same devices as is a conventional diepackage.

[0037]FIG. 5 is a partially broken top plan view of a die package 110 bhousing a reduced size die 120 a in accordance with another embodimentof the invention. The die 120 a has the same number of die terminals 121as does the conventional die 20 shown in FIGS. 1 and 2. The dieterminals 121, however, are more closely spaced than are the bond pads20 shown in FIG. 2. Accordingly, the overall size of the die 120 a maybe reduced when compared to the overall size of the die 20 shown in FIG.2. As shown in FIG. 5, the conductive members 140 are staggered so as toremain proximate to the corresponding die terminals 121. As a result,the overall size of the die package 110 b may be reduced when comparedto the die package 10 shown in FIG. 2. This configuration isadvantageous where it is desirable to reduce the size of the die 120 aand/or the package 112 housing the die, as is the case in any number ofmyriad of microelectronic applications.

[0038]FIG. 6 is a top plan view of a lead frame 141 formed duringmanufacture of the die package 110 a discussed above with reference toFIG. 4. A similar lead frame may be formed during manufacture of the diepackages 110, 110 b discussed above with reference to FIGS. 3 and 6. Thelead frame 141 comprises conductive members 140 substantially identicalto those shown in FIG. 4, except that the conductive members eachinclude an elongated portion 146 extending outwardly away from theterminal portions 143 thereof. The elongated portions 146 are connectedwith connective portions 147 so that each conductive member 140 has afixed location relative to the other conductive members. In oneembodiment, the lead frame 141 may be etched from a sheet of metallicmaterial, such as a nickel/iron alloy, a copper alloy or anothersuitable conductive material. In another embodiment, the lead frame 141may be stamped from a metallic sheet. Other manufacturing methods may beused in further embodiments.

[0039] As shown in FIG. 6, the die package 110 a may be formed byattaching the lead frame 141 to the die 120 and then encapsulating thedie and a portion of the lead frame in the body 112, the edges 113 ofwhich are shown in phantom lines in FIG. 6. In one embodiment, the leadframe 141 may be attached to the die by adhesively bonding theconductive members 140 to the upper surface 122 of the die 120 such thatthe bonding portions 142 of the conductive members are adjacent thecorresponding die terminals 141. The conductive couplings 150 (FIG. 4)may be connected between the die terminals 121 and the bonding portions142 without substantial risk that the die will move relative to theconductive members 140 and potentially disrupt the coupling establishedtherebetween. The lead frame 141 may then be clamped between two halvesof a mold (not shown), the inner edges of which correspond to the outeredges 113 of the body 112. The mold may be filled with a liquid orflowable non-conductive encapsulating material which is then allowed toharden, forming the body 112. The body 112, die 120, and lead frame 141may be removed as a unit from the mold and elongated portions 146 aretrimmed along trim lines 148 to remove excess material. The residual tabportions 149 may be bent perpendicular to the body 112 to form thepackage terminals or pins 130 shown in FIGS. 3-5.

[0040] An advantage of the lead frame 141 shown in FIG. 6 is that it hasa greater number of conductive members 140 than does a conventional leadframe. Accordingly, the lead frame 141 may provide additional supportfor the die 120 as it is encapsulated in the body 112, reducing thelikelihood that the die may move relative to the lead frame and disturbthe electrical connections formed therebetween.

[0041]FIG. 7 is a top plan view of another embodiment of a die package110 c having conductive members 140 which extend up to but not over thedie 120 b. The die 120 b has die terminals 121 spaced around theperiphery thereof, proximate to the bonding portions 142 of theconductive members 140 and are bonded to the bonding portions withconductive couplings 150, substantially as discussed above withreference to FIG. 3. The conductive members 140 are sized and shapedsimilarly to the conductive members shown in FIG. 3, so as to create astaggered pattern of bonding portions 142. During manufacture, theconductive members 140 may be interconnected with connective portions,substantially as discussed previously with reference to FIG. 6. Inaddition, the connective portions may be connected to paddle fingers 161which are in turn connected to a support paddle 160. The support paddle160 is positioned beneath the die 120 b and has the same generalplan-form shape as the die. The support paddle 160 and the paddlefingers 161 support the die relative to the conductive members 140 whenthe conductive members are coupled to the die terminals 121 with theconductive couplings 150.

[0042] As shown in FIG. 7, the conductive members 140 may beadvantageously staggered to increase the number of conductive memberswhich may be bonded to the die 120 b. As discussed previously withrespect to FIG. 3, the die 120 b may accordingly have more die terminals121 than a die housed in a conventional die package. The additionalconductive members 140 may be coupled to a conventional number ofpackage terminals 130, in a manner similar to that shown in FIG. 4, orto an increased number of package terminals in a manner similar to thatshown in FIG. 3. In another embodiment, the number of conductive members140 and package terminals 130 may be the same as a conventional diepackage, but the die 120 b and/or the die package 110 b may have areduced size when compared to their conventional counterparts, in amanner similar to that discussed above with reference to FIG. 5.

[0043]FIG. 8 is a plan view of a die package 110 d in accordance withanother embodiment of the invention having conductive members 140 andconductive couplers 150 sized to have a desired capacitance and/orimpedance. As discussed above with reference to FIG. 3, the conductivecouplers 150 may be formed from thin wire, having a generally circularcross-sectional shape and a relatively small surface area. Thecapacitance between pairs of conductive couplers 150 and/or between oneconductive coupler and ground is accordingly relatively low and theconductive couplers may not significantly reduce the rate at whichsignals propagate between the die terminals 121 and the packageterminals 130. The conductive members 140 may comprise portions of thinsheets having a relatively large surface area and the capacitancebetween pairs of conductive members 140 and/or between one conductivemember and ground may be relatively high. On the other hand, theconductive members 140 may be stronger and more rigid than theconductive couplers 150. The conductive members 140 may accordingly forma more stable connection between the die terminals 121 and the packageterminals 130, and may be less likely to break during manufacture andmay be less likely to flex to such a degree as to contact adjacentconductive members.

[0044] In one embodiment, the relative lengths of the conductivecouplers 150 and conductive members 140 are chosen to maintain arelatively low total capacitance while at the same time maintaining arelatively high level of stability. In another embodiment, otherdimensions of the conductive couplers 150 and conductive members 140,including the widths and thicknesses thereof, may be selected to reducethe capacitance between the die terminals 121 and package terminals 130while maintaining a stable connection therebetween which adequatelysupports the die 120 as the die package 110 d is manufactured.

[0045] The conductive couplers 150 discussed above may have a relativelyhigher inductance than the conductive members 140. Accordingly, in oneembodiment, where it is desirable to reduce the overall inductancebetween the die terminals 121 and the package terminals 130, the lengthof the conductive member 140 may be increased and the length of theconductive coupler 150 may be decreased. Conversely, where the circuitdesign is relatively independent of inductance, the conductive couplers150 may be as long as possible and the conductive members 140 may be asshort as possible to reduce overall capacitance. In one aspect of thisembodiment, the conductive members may be long enough to adequatelysupport the die 120 as the die package 110 d is manufactured.

[0046] In still a further alternate embodiment, the conductive couplers150 and conductive members 140 may be configured so that the impedancemeasured at each package terminal 130 is approximately equal even thoughthe impedance measured at each die terminal 121 may be different.Accordingly, a die terminal 121 a having a relatively low impedance maybe coupled via a relatively high impedance path to the correspondingpackage terminal 130 a. The high impedance path may include a shortconductive coupler 150 a having a relatively low impedance coupled to arelatively long conductive member 140 c having a relatively highimpedance. A die terminal 121 c having a relatively high impedance maybe coupled via a relatively low impedance path to its correspondingpackage terminal 130 c. The low impedance path may include a longconductive coupler 150 c coupled to a short conductive member 140 c. Therespective impedances of the conductive members 140 and conductivecouplers 150 may be selected based on the size and/or materialcomposition of the conductive members and couplers, as discussed above.

[0047] In yet a further alternate embodiment, the capacitances ratherthan the inductances measured at different package terminals 130 may beadjusted to be approximately equal by adjusting the size and/or shape ofthe conductive members 140 and conductive couplers 150 which extendbetween the package terminals 130 and the corresponding die terminals121.

[0048] One advantage of matching the impedance and/or capacitance of thepackage terminals 130, as discussed above, is that the die 120 may haveimproved operational characteristics as a result. By equating orapproximately equating the impedance and/or capacitance measured at eachpackage terminal 130, signals propagated to and from the die 120 maytend to arrive and depart in a more synchronous fashion, increasing thelikelihood that the signals will be properly synchronized with eachother and with other signals generated by other devices to which the diemay be connected.

[0049]FIG. 9 is an isometric view of the top surface of a substrate 126having staggered conductive members 140 thereon. In one embodiment, thesubstrate 126 may comprise a printed circuit board and may compriseanother semiconductor substrate in other embodiments. A semiconductordie 120 c having die terminals 121 b aligned with the conductive members140 is shown positioned above the substrate 126 in FIG. 9. In oneembodiment, the die terminals 121 b comprise solder balls which may beengaged with the bonding portions 142 of the corresponding conductivemembers 140. The terminal portions of the conductive members 140, notshown for purposes of clarity, may be coupled to other semiconductordies or other components. In other embodiments, the die terminals 121 bmay comprise other materials which may be heated so as to bond them tothe corresponding conductive couplers 140. In still further embodiments,the die terminals 121 b may comprise other materials which may beadhesively or otherwise bonded to the corresponding conductive members140.

[0050] As shown in FIG. 9, the conductive members 140 are staggered in amanner similar to that discussed previously with reference to FIGS. 3-8.Accordingly, an advantage of the conductive members 140 shown in FIG. 9is that a greater number of die terminals 121 b may be positioned withina given surface area of the die 120 c.

[0051]FIG. 10 is an isometric view of the top surface of a portion of asubstrate 126, such as a printed circuit board, having enlargedstaggered conductive members 140 d positioned thereon. As discussedabove with reference to FIG. 9, a semiconductor die 120 d having dieterminals 121 b may be aligned with the substrate 126 such that the dieterminals 121 b engage the bonding portions 142 a of the correspondingconductive members 140 d when the die 120 d is placed face down on thesubstrate. As shown in FIG. 10, the bonding portions 142 a of theconductive members 140 d are enlarged compared with the bonding portions142 of the conductive members 140 shown in FIG. 9. Accordingly, theenlarged bonding portions 142 a shown in FIG. 10 may provide a greaterbonding area and accordingly a greater bond strength between theconductive members 140 and the corresponding die terminals 121 b.Another advantage of the enlarged bonding portions 142 a is that theymay still align with the corresponding die terminal 121 b even if thedie 120 d itself is slightly misaligned relative to the substrate 126.Accordingly, the enlarged bonding portions 142 provide a margin forerror in the alignment process. As shown in FIG. 10, the staggeredarrangement of the conductive members 140 d allows enlarged bondingportions 142 to be positioned in the same area which would otherwise beoccupied by conventionally sized bonding portions.

[0052]FIG. 11 is a top isometric view of a semiconductor die 220attached to a substrate 226 having staggered conductive members 240 inaccordance with another embodiment of the invention. The substrate 226may include a printed circuit board having several layers 227 (shown as227 a, 227 b, and 227 c) formed from organic epoxy-glass resin basedmaterials, such as bis-maleimidie-triazine, or from a polyimide, aceramic material, or another suitable material. The uppermost layer 227a may include an attachment surface 228 to which the semiconductor die220 is attached, and the lowermost layer 227 c may include a contactsurface 229 opposite the attachment surface 228. A plurality of vias 252may extend from the attachment surface 228 through the layers 227 tocorresponding contacts 230 on the contact surface 229. For purposes ofclarity, only one connection between a via 252 and a contact 230 isshown in FIG. 11. In one embodiment, the contacts 230 may beflush-mounted on the contact surface 229, and in other embodiments, thecontacts 230 may include solder balls, such as are shown in FIG. 10, orother types of connectors. The contacts 230 may be coupled to otherdevices (not shown) to link the substrate 226 and the semiconductor die220 to the other devices.

[0053] The conductive members 240 may be positioned on the attachmentsurface 228 proximate to the semiconductor die 220. The conductivemembers 240 may be coupled to the vias 252 with traces 251, and may becoupled to corresponding die terminals 221 on the semiconductor die 220with conductive couplers 250 to transmit signals between thesemiconductor die and the contacts 230. The conductive couplers 250 maycomprise gold wire or other suitable conductive materials, as discussedabove with reference to FIG. 3. As discussed above with respect to FIG.8, the capacitance of the conductive couplers 250, the traces 251, andthe conductive members 240 may be selected to produce a desiredimpedance and/or capacitance at the die terminals 221.

[0054] As shown in FIG. 11, adjacent conductive members 240 may bestaggered or offset relative to one another and relative an edge 222 ofthe semiconductor die 220. The conductive members 240 may have agenerally square shape in the embodiment shown in FIG. 11, and may haveother shapes in other embodiments. In one embodiment, the conductivemembers 240 may be etched into the attachment surface 228, and in otherembodiments the conductive members may be bonded to the attachmentsurface. In any of the foregoing embodiments, an advantage of thesubstrate 226 and the conductive members 240 shown in FIG. 11 is that anincreased number of conductive members 240 may be positioned adjacentthe semiconductor die 220, permitting an increased number of connectionsbetween the semiconductor die and the substrate 226.

[0055]FIG. 12 is a schematic of a computer 160 having a data inputdevice 161 and a data output device 162. The data input and outputdevices 161 and 162 are coupled to circuitry 163 within the computer 160that may include, but is not limited to, a processor 165, a memory 166and a chipset 164. In one embodiment, the processor 165 includes a diepackage 110 that is generally similar to the die package shown in FIG.3. In other embodiments, the chipset 164 and/or the memory 166 and/orother circuitry components (not shown) may include a die package 110. Instill further embodiments, the circuitry 163 may include die packagesgenerally similar to any of the die packages shown in FIGS. 4-11.

[0056] From the foregoing it will be appreciated that, although specificembodiments of the invention have been described herein for purposes ofillustration, various modifications may be made without deviating fromthe spirit and scope of the invention. Accordingly, the invention is notlimited except as by the appended claims.

1. A microelectronic device, comprising: a semiconductor die having atleast one terminal; and an elongated conductive member extending betweena first end portion and a second end portion thereof, the second endportion being at least proximate the terminal of the die, the conductivemember further having an intermediate portion between the first andsecond end portions, a width of the intermediate portion being less thana width of the second end portion.
 2. The device of claim 1 wherein atleast the second end portion of the conductive member engages a surfaceof the semiconductor die.
 3. The device of claim 1 wherein theconductive member is affixed to the die.
 4. The device of claim 1wherein the terminal of the die comprises a solder ball, the solder ballbeing engaged with the second end portion of the conductive member. 5.The device of claim 1 wherein the second end portion of the conductivemember is proximate an edge of the semiconductor die.
 6. The device ofclaim 1, further comprising a conductive coupler having a first endcoupled to the terminal and a second end coupled to the second endportion of the conductive member to electrically couple the terminal tothe conductive member.
 7. The device of claim 6 wherein the size andshape of the conductive member are selected to produce a firstcapacitance and the size and shape of the conductive coupler areselected to produce a second capacitance, the conductive member and theconductive coupler together producing a selected third capacitance. 8.The device of claim 6 wherein the conductive member is selected to havea first inductance and the conductive coupler is selected to have asecond inductance, the conductive member and the conductive couplertogether producing a selected third inductance at the first end portionof the conductive member.
 9. The device of claim 6 wherein theconductive coupler comprises at least one of a gold wire, an aluminumwire and a conductive adhesive.
 10. The device of claim 1 wherein theconductive member comprises at least one of a copper alloy and anickel/iron alloy.
 11. A microelectronic device, comprising: a support;a semiconductor die having at least one terminal, the semiconductor dieengaging the support; and an elongated conductive member having a firstend portion and a second end portion opposite the first end portion, thesecond end portion being proximate the die, the conductive member havingan intermediate portion between the first and second end portions, awidth of the intermediate portion being less than a width of the secondend portion.
 12. The device of claim 11, further comprising a conductivecoupler having a first end coupled to the terminal and a second endcoupled to the second end portion of the conductive member toelectrically couple the terminal to the conductive member.
 13. Thedevice of claim 12 wherein the conductive coupler comprises a gold wire.14. The device of claim 12 wherein the conductive member is sized andshaped to produce a first capacitance and the conductive coupler issized and shaped to produce a second capacitance, the conductive memberand the conductive coupler together producing a selected thirdcapacitance.
 15. The device of claim 12 wherein the conductive member isselected to have a first inductance and the conductive coupler isselected to have a second inductance, the conductive member and theconductive coupler together producing a selected third inductance at thefirst end portion of the conductive member.
 16. The device of claim 11wherein the conductive member comprises at least one of a copper alloyand a nickel/iron alloy.
 17. The device of claim 11, further comprisingan encapsulating material attached to the support and surrounding thedie, the encapsulating material forming a package which houses the dietherein.
 18. A microelectronic device, comprising: a semiconductor diehaving at least one terminal; and a conductive member extending betweena first end portion and a second end portion thereof, the second endportion being in contact with a surface of the semiconductor dieproximate the terminal, the conductive member having an intermediateportion between the first and second end portions, a width of theintermediate portion being less than a width of the second end portion.19. The device of claim 18, further comprising a conductive couplerhaving a first end coupled to the terminal and a second end coupled tothe second end portion of the conductive member to electrically couplethe terminal to the conductive member.
 20. The device of claim 19wherein the conductive coupler comprises a gold wire.
 21. The device ofclaim 19 wherein the conductive member is selected to produce a firstcapacitance and the conductive coupler is selected to produce a secondcapacitance, the conductive member and the conductive coupler togetherproducing a selected third capacitance.
 22. The device of claim 19wherein the conductive member is selected to have a first inductance andthe conductive coupler is selected to have a second inductance, theconductive member and the conductive coupler together producing aselected third inductance at the first end portion of the conductivemember.
 23. The device of claim 18 wherein the conductive membercomprises at least one of a copper alloy and a nickel/iron alloy.
 24. Amicroelectronic device, comprising: a semiconductor die having at leastone terminal; and a conductive member elongated between a first endportion and a second end portion thereof, the second end portion beingin contact with the terminal, the conductive member having anintermediate portion between the first and second end portions, a widthof the intermediate portion being less than a width of the second endportion.
 25. The device of claim 24 wherein the at least one terminal ispositioned on a lower surface of the semiconductor die.
 26. The deviceof claim 24 wherein the at least one terminal comprises a solder ballbonded to the second end portion of the conductive member.
 27. Thedevice of claim 24 wherein the conductive member comprises at least oneof a copper alloy and a nickel/iron alloy.
 28. The device of claim 24wherein the conductive member is sized and shaped to produce a firstcapacitance and the conductive coupler is sized and shaped to produce asecond capacitance, the conductive member and the conductive couplertogether producing a selected third capacitance.
 29. The device of claim24 wherein the conductive member is selected to have a first inductanceand the conductive coupler is selected to have a second inductance, theconductive member and the conductive coupler together producing aselected third inductance at the first end portion of the conductivemember.
 30. A microelectronic device, comprising: a die having first andsecond terminals; a first conductive member elongated between a firstend portion and a second end portion thereof, the second end portionbeing proximate to the first terminal of the die; and a secondconductive member elongated between a first end portion and a second endportion thereof, the second conductive member being generally parallelto the first conductive member, the second end portion of the secondconductive member being proximate to the second terminal of the die, thesecond end portion of the second conductive member being offset alongthe second longitudinal axis from the second end portion of the firstconductive member.
 31. The device of claim 30 wherein a width of theintermediate portion of the first conductive member is less than a widthof the second end portion of the first conductive member.
 32. The deviceof claim 30 wherein the second end portion of at least one of the firstand second conductive members is in contact with a surface of the die.33. The device of claim 30 wherein the second end portion of at leastone of the first and second conductive members is spaced apart from thedie.
 34. A microelectronic device, comprising: a die having first andsecond terminals; a first conductive member elongated between a firstend portion and a second end portion thereof, the second end portionbeing proximate to the first terminal of the die, the first conductivemember further having a first intermediate portion between the first andsecond end portions thereof, a width of the first intermediate portionbeing less than a width of the second end portion; a first conductivecoupler coupled to and extending between the first terminal of the dieand the second end portion of the first conductive member; a secondconductive member elongated between first and second end portionsthereof, the second end portion of the second conductive member beingproximate to the second terminal of the die, the second conductivemember further having a second intermediate portion between the firstand second end portions thereof, a width of the second intermediateportion being less than a width of the second end portion of the secondconductive member, the second end portion of the second conductivemember being axially offset relative to the second end portion of thefirst conductive member; and a second conductive coupler coupled to andextending between the second terminal of the die and the second endportion of the second conductive member.
 35. The device of claim 34wherein the second end portion of at least one of the first and secondconductive members engages a surface of the die.
 36. The device of claim34 wherein the second end portion of at least one of the first andsecond conductive members is spaced apart from the die.
 37. Amicroelectronic device, comprising: a package having first and secondpackage terminals; a semiconductor die positioned within the package andhaving first and second die terminals; a first conductive member havingfirst and second opposite ends and coupled at the first end to the firstpackage terminal; a first conductive coupler having first and secondopposite ends and coupled at the first end thereof to the first dieterminal and coupled at the second end thereof to the second end of thefirst conductive member; a second conductive member having first andsecond opposite ends and coupled at the first end thereof to the secondpackage terminal; and a second conductive coupler having first andsecond opposite ends and coupled at the first end thereof to the seconddie terminal and coupled at the second end thereof to the second end ofthe second conductive member, the first conductive member and firstconductive coupler being selected to produce a first impedance at thefirst package terminal and the second conductive member and secondconductive coupler being selected to produce a second impedance at thesecond package terminal, the first impedance being approximately equalto the second impedance.
 38. The device of claim 37 wherein the firstand second conductive couplers comprise gold wire.
 39. The device ofclaim 37 wherein the first and second conductive members comprise atleast one of a copper alloy and a nickel/iron alloy.
 40. Amicroelectronic device, comprising: a package having first and secondpackage terminals; a semiconductor die positioned within the package andhaving first and second die terminals; a first conductive member havingfirst and second opposite ends and coupled at the first end to the firstpackage terminal; a first conductive coupler having first and secondopposite ends and coupled at the first end thereof to the first dieterminal and coupled at the second end thereof to the second end of thefirst conductive member; a second conductive member having first andsecond opposite ends and coupled at the first end thereof to the secondpackage terminal; and a second conductive coupler having first andsecond opposite ends and coupled at the first end thereof to the seconddie terminal and coupled at the second end thereof to the second end ofthe second conductive member, the first conductive member and firstconductive coupler being selected to produce a first capacitance and thesecond conductive member and second conductive coupler being selected toproduce a second capacitance, the first capacitance being approximatelyequal to the second capacitance.
 41. The device of claim 40 wherein thefirst capacitance is measured between the first die terminal and groundand the second capacitance is measured between the second die terminaland ground.
 42. The device of claim 40 wherein the package has a thirdpackage terminal and the semiconductor die has a third die terminal,further comprising a third conductive member coupled to the thirdpackage terminal and a third conductive coupler coupled between thethird conductive member and the third die terminal, the firstcapacitance being measured between the first and third die terminals,the second capacitance being measured between the second and third dieterminals.
 43. The device of claim 40 wherein the first and secondconductive couplers comprise wire having a generally circularcross-sectional shape.
 44. The device of claim 40 wherein the first andsecond conductive members have a generally planar shape.
 45. Amicroelectronic device, comprising: a substrate having a firstconductive member and a second conductive member spaced apart from thefirst conductive member; a die having first and second terminals and anedge, the die being attached to the substrate such that a distancebetween the first conductive member and the edge is different than adistance between the second conductive member and the edge.
 46. Thedevice of claim 45 wherein at least one of the first and secondconductive members has a generally rectangular portion proximate thedie.
 47. The device of claim 45, further comprising: a first conductivecoupler coupled to and extending between the first conductive member andthe first terminal of the die; and a second conductive coupler coupledto and extending between the second conductive member and the secondterminal of the die.
 48. The device of claim 47 wherein the firstconductive coupler is selected to produce a first capacitance and thesecond conductive coupler is selected to produce a second capacitance,the first capacitance being approximately equal to the secondcapacitance.
 49. The device of claim 48 wherein the first capacitance ismeasured between the first terminal of the die and ground and the secondcapacitance is measured between the second terminal of the die andground.
 50. The device of claim 45 wherein the substrate includes aprinted circuit board.
 51. The device of claim 50 wherein the printedcircuit board comprises a plurality of layers and the die is attached toone of the plurality of layers.
 52. The device of claim 45, wherein thesubstrate has a first surface and a second surface opposite the firstsurface and the die is attached to the first surface of the substrate,further comprising: a first conductive via proximate to the firstsurface, extending beneath the first surface and coupled to the firstconductive member; and a second conductive via proximate the firstsurface, extending beneath the first surface and coupled to the secondconductive member.
 53. The device of claim 52 wherein the second surfacehas a first contact coupled to the first via and a second contactcoupled to the second via.
 54. The device of claim 53 wherein at leastone of the first and second contacts is a solder ball.
 55. The device ofclaim 53 wherein at least one of the first and second contacts isgenerally flush with the contact surface.
 56. The device of claim 45wherein at least one of the first and second conductive members isetched on a surface of the substrate.
 57. A computer system, comprising:a data input device; a data output device; and computing circuitrycoupled to the data input and output devices, the computing circuitryincluding a semiconductor die having at least one terminal; and aconductive member elongated between a first end portion and a second endportion thereof, the second end portion being proximate the terminal ofthe die, the conductive member having an intermediate portion betweenthe first and second end portions, a width of the intermediate portionbeing less than a width of the second end portion.
 58. The computersystem of claim 57 wherein the computing circuitry further includes aconductive coupler coupled to and extending between the terminal of thedie and the second end portion of the conductive member.
 59. Thecomputer system of claim 58 wherein the conductive member is selected tohave a first impedance and the conductive coupler is selected to have asecond impedance, the conductive member and conductive coupler togetherproducing a selected third impedance at the first end portion of theconductive member.
 60. The computer system of claim 57 wherein theterminal is a first terminal, the conductive member is a firstconductive member, and the circuitry further includes a second terminalpositioned adjacent the first terminal and a second conductive memberelongated between a first end portion and a second end portion thereof,the second end portion of the second conductive member being proximateto and coupleable to the second terminal, the second end portion of thesecond conductive member being offset relative to the second end portionof the first conductive member.
 61. The computer system of claim 60wherein the second conductive member has an intermediate portion betweenthe first and second end portions thereof, a width of the intermediateportion of the second conductive member being less than a width of thesecond end portion of the second conductive member.
 62. The computersystem of claim 60 wherein the computing circuitry further includes afirst coupling member extending between the first terminal and thesecond end portion of the first conductive member and a second couplingmember extending between the second terminal and the second end portionof the second conductive member, the first coupling member and firstconductive member being selected to produce a first impedance at thefirst end portion of the first conductive member, the second couplingmember and second conductive member being selected to produce a secondimpedance and the first end portion of the second conductive memberapproximately equal to the first impedance.
 63. A method for coupling afirst conductive member to a first terminal of a semiconductor die and asecond conductive member to a second terminal of the die, eachconductive member being elongated between a first end portion and asecond end portion thereof, each conductive member having anintermediate portion between the first and second end portions thereof,the method comprising: positioning the second end portion of the firstconductive member proximate the first terminal; and positioning thesecond end portion of the second conductive member proximate the secondterminal and proximate the intermediate portion of the first conductivemember, the second end portion of the second conductive member beingoffset from the second end portion of the first conductive member. 64.The method of claim 63, further comprising: electrically coupling thefirst terminal to the second end portion of the first conductive member;and electrically coupling the second terminal to the second end portionof the second conductive member.
 65. The method of claim 63 wherein theact of positioning the second end portion of the first conductive memberincludes engaging the second end portion with a surface of thesemiconductor die.
 66. The method of claim 63 wherein the act ofpositioning the second end portion of the first conductive memberincludes spacing the second end portion a selected distance away fromthe semiconductor die.
 67. The method of claim 63, further comprisingselecting a length of at least the first conductive member to resistmotion of the first conductive member away from the die when the firstconductive member is attached to the die.
 68. The method of claim 63,further comprising adhesively bonding the first conductive member to thedie.
 69. A method for positioning conductive members proximate to firstand second adjacent terminals of a semiconductor die, the methodcomprising: positioning an end of a first conductive member proximatethe first terminal of the die; and positioning an end of a secondconductive member proximate the second terminal of the die such that theend of the second conductive member is spaced apart from the secondterminal by a distance which is greater than a distance between the endof the first conductive member and the first terminal.
 70. The method ofclaim 69 wherein the act of positioning the second end portion of thefirst conductive member includes engaging the second end portion with asurface of the semiconductor die.
 71. The method of claim 69 wherein theact of positioning the second end portion of the first conductive memberincludes spacing the second end portion a selected distance away fromthe semiconductor die.
 72. The method of claim 69, further comprising:electrically coupling the first terminal to the first conductive member;and electrically coupling the second terminal to the second conductivemember.
 73. The method of claim 69 wherein the first and secondconductive members are positioned on a printed circuit board, furthercomprising coupling the first conductive member to a first via of theprinted circuit board and coupling the second conductive member to asecond via of the printed circuit board.
 74. A method for selecting theimpedance of a conductive path between a terminal of a semiconductor dieand a terminal of a package in which the die is housed, the methodcomprising: selecting a conductive member to have a first impedance;selecting a conductive coupler to have a second impedance; connecting afirst end of the conductive member to the terminal of the package; andconnecting the conductive coupler to extend between the terminal of thedie and a second end of the conductive member opposite the first end ofthe conductive member.
 75. The method of claim 74 wherein the terminalof the semiconductor die is a first die terminal, the terminal of thepackage is a first package terminal, and the conductive paththerebetween is a first conductive path, the die having a second dieterminal, the package having a second package terminal, the methodfurther comprising: selecting a second conductive member connected tothe second package terminal and a second conductive coupler coupledbetween the second conductive member and the second die terminal toproduce an impedance at the second package terminal approximately equalto an impedance at the first die terminal.
 76. The method of claim 74wherein the act of selecting a conductive member includes selecting asize of the conductive member.
 77. The method of claim 74 wherein theact of selecting a conductive member includes selecting a materialcomprising the conductive member.
 78. The method of claim 74 wherein theact of selecting the conductive coupler includes selecting a size of theconductive coupler.
 79. The method of claim 74 wherein the act ofselecting a conductive coupler includes selecting a material comprisingthe conductive coupler.
 80. A method for selecting the capacitance of aconductive path between a terminal of a semiconductor die and a terminalof a package in which the die is housed, the method comprising:selecting a conductive member to produce a first capacitance; selectinga conductive coupler to produce a second capacitance; connecting a firstend of the conductive member to the terminal of the package; andconnecting the conductive coupler to extend between the terminal of thedie and a second end of, the conductive member opposite the first end ofthe conductive member.
 81. The method of claim 80 wherein the first andsecond capacitances are measured relative to ground.
 82. The method ofclaim 80 wherein the terminal of the semiconductor die is a first dieterminal, the terminal of the package is a first package terminal andthe conductive path therebetween is a first conductive path, thesemiconductor die having a second die terminal coupled to a secondpackage terminal with a second conductive member and a second conductivecoupler, the second conductive member and second conductive couplercomprising a second conductive path, the first and second capacitancesbeing measured relative to the second conductive path.
 83. The method ofclaim 80 wherein the terminal of the semiconductor die is a first dieterminal, the terminal of the package is a first package terminal, andthe conductive path therebetween is a first conductive path, the diehaving a second die terminal, the package having a second packageterminal, the method further comprising: selecting a second conductivemember connected to the second package terminal and a second conductivecoupler coupled between the second conductive member and the second dieterminal to produce a capacitance at the second package terminalapproximately equal to a capacitance at the first package terminal. 84.The method of claim 83 wherein the capacitances at the first and secondpackage terminals are measured relative to ground.
 85. The method ofclaim 80 wherein the act of selecting a conductive member includesselecting a size of the conductive member.
 86. The method of claim 80wherein the act of selecting a conductive member includes selecting ashape of the conductive member.
 87. The method of claim 80 wherein theact of selecting the conductive coupler includes selecting a size of theconductive coupler.
 88. The method of claim 80 wherein the act ofselecting a conductive coupler includes selecting a shape of theconductive coupler.